环氧模塑封装材料的蠕变损伤研究

The Study on the Creep Damage of Epoxy Molding Compound

文章对环氧模塑封装材料(EMC)的蠕变损伤进行了实验研究,对断口进行了扫描电镜观察,获取了EMC材料蠕变失效的微观机理。应用修正的Lermaitre蠕变损伤模型来描述损伤参数及预测蠕变损伤寿命。实验结果表明:EMC材料的蠕变具有明显的蠕变演化的三个阶段;颗粒与基质间的界面脱层和微空洞相互间的级联扩张是引发试样蠕变断裂失效的根本原因;由蠕变损伤模型预测的蠕变寿命在应力水平较低的情况下与实验吻合较好。

In this paper, the creep damage of the Epoxy Molding Compound （EMC） has been tested and studied. The fracture surfaces of the specimens were analyzed by scanning electron microscope to investigate the creep failure microcosmic mechanism. A modified Lermaitre creep damage model was used in a first attempt to describe damage parameter of EMC and predict the creep damage life. The results show that creep behavior of EMC can be characterized as primary, secondary, and tertiary creep, and volume damage is done before the cracks propagates by void and debonding between particle and matrix coalescence. The creep lifetime obtained by the creep damage model agrees to the experimental results well at relatively low stress level.