摘要
静电损伤失效可能是热击穿(电流)造成的结或金属布线熔融失效,也可能是强电场(电压)诱发的介质失效,文章主要从电流热击穿方面探讨了静电触发时的ESD(Electro-Static-Discharge)保护结构的保护机理和失效机理以及工艺和版图上的应对措施。保护结构工作时的电流泄放能力决定了其保护能力,这种能力可以通过使泄放电流均匀、优化PN结特性等方面加强。电流泄放的均匀性可以在工艺版图上进行优化,结两侧浓度决定了结的耐受能力和结上的偏压,进而影响器件功耗。另外还提及了保护结构的负面影响以及工艺上的优化方案。
Electro-Static-Discharge （ESD） failure probably led by heat breakdown （high current density） which damages pn junction or metal line, also probably led by strong electric field （high voltage stress） which make dielectric breakdown. The ESD protection circuit work and failure mechanism are discussed and some advices about layout and manufacture process are given. The ability of releasing current is very important to a protection circuit. This ability can be streng by current and optimize the PN junction characteristic.
出处
《电子与封装》
2009年第9期28-30,48,共4页
Electronics & Packaging
关键词
结温
二次击穿电流
均匀放电
工艺
版图
junction temperature
second breakdown current
uniform discharge
process
layout
