关于提高环氧塑封料强度的研究

Research on Strength Enhancement of Epoxy Molding Compound

环氧塑封料的强度在电子封装生产中影响了器件的可靠性和工艺操作性。文章就几种影响环氧塑封料强度的因素进行了实验分析,通过对环氧塑封料固化过程中的弯曲强度和弯曲模量的动态检测,并设定一个模拟环氧塑封料在封装工艺中强度变化的判定标准,可以直接判断其工艺适用性(即"断筋"与否)。文章从塑封料组分中填料的含量与粒度分布、固化促进剂种类与含量、固化剂种类、以及相关改性剂等几方面进行了试验研究,总结出其中重要的影响因素。根据实验结果,可以对环氧塑封料产品的强度进行显著的控制和改进。同时,本研究也有利于对环氧塑封料的"翘曲"、"溢料"等性能的研究和改善。

The mechanical strength of epoxy molding compound （EMC） affects the reliability of electronic devices and its manufacturability in electronic encapsulation. This paper discussed and analyzed several the influence factors of EMC strength by experimental data, based on the measurement of flexural strength and flexural modulus in situ on curing of EMC, and take a value B as criterion, the manufacturability （break or not） of EMC at the moment of encapsulation could be determined directly. Experimental research was carried out by analysis of the amount and distribution of silica powder, the sorts and amount of accelerators, the sorts of hardeners, and other related modifying agent, several important factors were found. As a result, the strength of EMC could be controlled and improved efficiently. Other moldabilities of EMC such as warpage and bleed could also be developed by the data of this paper accordingly.