电沉积Sn-Bi合金工艺的研究

A Study of Sn-Bi Alloy Electrodepositing Process

采用硫酸盐镀液在铜基体上电沉积Sn-Bi镀层,利用能谱仪(EDS)、扫描电子显微镜(SEM)和X射线衍射仪(XRD)研究了电沉积参数对镀层成分和微观结构的影响。结果表明:镀层中Sn的质量分数随着镀液中Sn的质量浓度的增大而增大,同时随着电流密度的增大,Sn的质量分数不断减少;Sn-Bi镀层主要由四方晶系的Sn和菱形晶系的Bi组成;另外,研究发现电流密度对镀层形貌影响较大。

Sn-Bi films were electrodeposited on Cu substrate from a sulphate bath. The effects of plating parameters on the composition and microstructure of electrodeposits were investigated by means of energy dispersive X-ray spectroscopy （EDS）, scanning electron microscope （SEM） and X-ray diffraction （XRD）. The results show that the mass fraction of Sn in deposit increases with the increasing of SnSO4 concentration in the bath, but continuously decreases with the increasing of current density. XRD patterns show that the Sn-Bi films mainly consist of tetragonal phase tin and rhombohedral phase bismuth. In addition, it is found that the impact of current density on the morphology of deposited Sn-Bi films is more remarkable.