锗元素对Sn-3.5Ag合金/铜界面反应的影响

Effect of Ge on Interfacial Reaction Sn-3.5Ag Alloy/Cu Interface

通过向Sn-3.5Ag共晶合金中添加质量分数为0.1%,0.3%的锗元素,研究了锗元素对Sn-3.5Ag合金/铜界面反应的影响。结果表明:对于Sn-3.5Ag合金/铜界面,没加入锗元素时界面反应初生相为扇贝状Cu6Sn5,在热老化过程中此化合物层不断长大,且在Cu6Sn5/铜界面处生成新的Cu3Sn化合物,同时在Cu3Sn/铜界面上出现柯肯达尔空洞;当钎料中添加锗后,界面初生相也为Cu6Sn5化合物,在热老化阶段,Cu6Sn5化合物层厚度增长非常缓慢,且无Cu3Sn化合物生成,整个老化过程中都无柯肯达尔空洞出现。

Effect of C-e on the interfacial reaction of Sn-3. 5Ag alloy （SA）/Cu interface was investigated through adding a small amount of Ge （0. 1wt%, 0. 3wt%） into Sn-3. 5 Ag emtectic alloy. The results show that the initial phase at the SA/Cu interface without Ge addition was scallop like Cu6Sn5 A new layer, which was determined as Cu3Sn, was formed at Cu6Sn5/Cu interface and grew continously after isothermal aging, and Kirkendall voids were found at Cu3 Sn/Cu interface. For SA-xGe/Cu interface, the initial phase was still Cu6Sn5. The growth rate of Cu6Sn5 was decelerated. The Cu3Sn did not form. During aging, no Kirkendall voids were found.