摘要
通过向Sn-3.5Ag共晶合金中添加质量分数为0.1%,0.3%的锗元素,研究了锗元素对Sn-3.5Ag合金/铜界面反应的影响。结果表明:对于Sn-3.5Ag合金/铜界面,没加入锗元素时界面反应初生相为扇贝状Cu6Sn5,在热老化过程中此化合物层不断长大,且在Cu6Sn5/铜界面处生成新的Cu3Sn化合物,同时在Cu3Sn/铜界面上出现柯肯达尔空洞;当钎料中添加锗后,界面初生相也为Cu6Sn5化合物,在热老化阶段,Cu6Sn5化合物层厚度增长非常缓慢,且无Cu3Sn化合物生成,整个老化过程中都无柯肯达尔空洞出现。
Effect of C-e on the interfacial reaction of Sn-3. 5Ag alloy (SA)/Cu interface was investigated through adding a small amount of Ge (0. 1wt%, 0. 3wt%) into Sn-3. 5 Ag emtectic alloy. The results show that the initial phase at the SA/Cu interface without Ge addition was scallop like Cu6Sn5 A new layer, which was determined as Cu3Sn, was formed at Cu6Sn5/Cu interface and grew continously after isothermal aging, and Kirkendall voids were found at Cu3 Sn/Cu interface. For SA-xGe/Cu interface, the initial phase was still Cu6Sn5. The growth rate of Cu6Sn5 was decelerated. The Cu3Sn did not form. During aging, no Kirkendall voids were found.
出处
《机械工程材料》
CAS
CSCD
北大核心
2009年第9期21-24,共4页
Materials For Mechanical Engineering
关键词
无铅钎焊
金属间化合物
界面反应
柯肯达尔效应
lead--free solder
intermetallic compound
interracial reaction
Kirkendall effect