期刊文献+

A novel structure of a high current gain 4H-SiC BJT with a buried layer in the base

A novel structure of a high current gain 4H-SiC BJT with a buried layer in the base
下载PDF
导出
摘要 In this paper, a new structure of a 4H-SiC bipolar junction transistor (BJT) with a buried layer (BL) in the base is presented. The current gain shows an approximately 100% increase compared with that of the conventional structure. This is attributed to the creation of a built-in electric field for the minority carriers to transport in the base which is explained based on 2D device simulations. The optimized design of the buried layer region is also considered by numeric simulations. In this paper, a new structure of a 4H-SiC bipolar junction transistor (BJT) with a buried layer (BL) in the base is presented. The current gain shows an approximately 100% increase compared with that of the conventional structure. This is attributed to the creation of a built-in electric field for the minority carriers to transport in the base which is explained based on 2D device simulations. The optimized design of the buried layer region is also considered by numeric simulations.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2009年第9期3995-3999,共5页 中国物理B(英文版)
关键词 4H-SIC bipolar junction transistor (BJT) buried layer current gain 4H-SiC, bipolar junction transistor (BJT), buried layer, current gain
  • 相关文献

参考文献18

  • 1Krishnaswami S, Agarwal A, Ryu S H, Capell C, Richmond J, Palmour J, Balachandran S, Chow T P, Bayne S, Geil B, Jones K and Scozzie C 2005 Electron Device Lett. 26 175.
  • 2Balachandran S, Chow T P, Agarwal A, scozzie C and Jones K A 2005 Electron Device Lett. 26 470.
  • 3Ivanov P A, Levinshtein M E, Agarwal A K, Krishnaswami S and Palmour J W 2006 Electron Devices 53 1245.
  • 4Zhang J H, Li X Q, Alexandrov P, Fursin L, Wang X H and Zhao J H 2008 Electron Devices 55 1899.
  • 5Domeij M, Lee H S, Danielsson E, Zetterling C M, Ostling M and Schoner A 2005 Electron Device Lett. 26 743.
  • 6Zhang J, Luo Y, Alexandrov P, Fursin L and Zhao J H 2003 Electron Device Lett. 24 327.
  • 7Huang C F and Cooper J A 2003 Electron Device Lett. 24 396.
  • 8Zhang J H, Li X Q, Alexandrov P, Burke T and Zhao J H 2008 Electron Device Lett. 29 471.
  • 9Deng X C, Zhang B and Li Z J 2007 Semiconductor Science and Technology 22 1339.
  • 10Deng X C, Zhang B, Li Z J and Chen Z L 2007 Semiconductor Science and Technology 22 701.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部