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大功率发光二极管光源模块的封装热分析 被引量:1

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摘要 建立了大功率发光二极管(Light Emitting Diode,简称LED)光源模块的一种封装结构,采用热通路和电通路分离的改进方案,并用有限元方法对其进行热分析,比较了不同LED间隔和功率、基板底面不同对流强度等情况下光源模块的散热性能,仿真结果显示,在使用大功率(>1W)LED时,自然对流不能满足光源模块的散热要求,必须加载强制对流装置。
作者 李季 倪玉山
出处 《光源与照明》 2009年第3期1-5,共5页 Lamps & Lighting
基金 国家自然科学基金项目资助(10576010)
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