摘要
S型微弹簧是一种在微机电系统中应用广泛的微弹性元件,利用力学分析法,首次推导出S型微弹簧在空间3个方向上的弹性系数计算公式,ANSYS仿真验证了公式推导的正确性。采用LIGA工艺,设计加工了一种金属镍S型微弹簧。用精密微小型计算机显微测量仪测量得到微弹簧的线宽,长度和厚度与设计值的误差分别为4μm、50μm和24μm。分析了微弹簧各个结构参数的加工误差对微机电系统(MEMS)微弹簧力学特性的影响,指出微弹簧线宽的加工误差对其力学特性影响最大,Tytron250微小力拉伸实验机实验验证了结论的正确性。
S style microspring is a widely used micro elastic element in MEMS. The spring coefficient formulas of S style microspring in three directions were deduced by mechanical analysis method firstly, which were validated by ANSYS simulation. An S style LIGA-Ni microspring was designed and fabricated. The structure parameters error of line width,length and depth about S style microspring between the fabricated and design numbers were 4 μm,50 μm and 24 μm separately, which were measured by a precise micro computer measuring instrument. The effects of fabrication errors of structure parameters on the mechanical performance of S style microspring were analyzed. It showed that the mechanical performance of microspring was affected by the fabrication error of microspring line width mostly,which was validated by the experiment of Tytron250 micro force test machine.
出处
《压电与声光》
CSCD
北大核心
2009年第5期735-737,741,共4页
Piezoelectrics & Acoustooptics
基金
国防科技重点实验室基金资助项目(514850301)
