超导温度下微波混合集成电路工艺可靠性初探

Reliability investigation on microvave HIC technologies under critical transition temperature of superconductor

为研制可靠的高温超导微波组件设计了可靠性试验,研究了高温超导微波组件常用的微波混合集成电路工艺,如锡铅钎焊、共晶焊接和金丝焊接等在超导温度下的可靠性。结果表明:在经历温度循环、机械冲击、变频振动和恒定加速度试验后,所研究的工艺能满足GJB548B—2005的相关要求,其中锡铅钎焊的试样可以通过1×10–9Pa.m3/s的泄漏率要求,设计的环境试验对80Au-20Sn共晶焊接性能无显著影响。

MHIC （short for microwave hybrid integrated circuit） technologies were applied in the HTS （short for high temperature superconductor） microwave module. The reliability of typical MHIC technologies such as SnPb soldering, eutectic soldering, Au wire soldering and ribbon bonding were investigated under critical transition temperature of supercon ductor. Results show that the researched technologies can meet the related requirements of GJB548B--2005 after suffering temperature cycling, mechanic shock, variable frequency vibration and constant acceleration test. The leak rate of the SnPb soldering sample is less than 1×10^-9Pa·m^3/s, which can meet the hermetical requirements of GJB548B--2005. On the other hand, the designed tests have no obviouse effect on the properties of gold tin eutectic soldering.