摘要
用355 mm紫外激光进行了蓝宝石晶圆的划切试验,通过改变激光的脉冲重复频率、入射能量密度和扫描速度,得到了多组微槽。对微槽的划切质量、深度和宽度进行检测和分析。结果表明,紫外激光划切蓝宝石晶圆能获得良好的微槽结构;不同的入射激光能量密度、脉冲重复频率和扫描速度对微槽的深度和宽度有不同的影响;晶圆表面粗糙度对微槽的划切质量影响很大。
The dicing of sapphire by UV laser is reported. Several microgrooves have been produced by varying Laser Pulse Repetition Frequency （PRF）, incident laser fluence and scanning speed. The dicing quality, depth and width of microgrooves have been measured and investigated. The results show that the dicing quality of sapphire by UV laser is good, the incident laser fluence has large effect on the dicing quality, and the changes of incident laser fluence, PRF and scanning speed influence the dicing depth and width, the surface roughness of wafer has large effect on the dieing quality.
出处
《电加工与模具》
2009年第5期35-38,43,共5页
Electromachining & Mould
