相变牺牲层结合UV胶室温黏接玻璃微流控芯片

Phase-changing sacrificial layer for UV-bonding of glass microfluidic chip at room temperature

提出了一种室温封合玻璃微流控芯片的新方法.利用毛细作用将熔化的石蜡液体填充开放的玻璃微通道,冷却后石蜡固体形成牺牲层材料.用UV胶作为黏接剂来封合玻璃基片和盖片.用紫外光通过掩模对UV胶进行选择性曝光,使玻璃基片和盖片被UV胶黏接在一起.加热除去石蜡牺牲层后,得到微通道表面性质基本一致的玻璃微流控芯片.此芯片已成功用于氨基酸的电泳分离.此方法还可实现电极在玻璃芯片上的集成.

A novel method for adhesive bonding of glass microfluidic chips at room temperature was developed. Channels in an etched glass substrate were filled with a heated paraffin liquid that formed a solid sacrificial layer at room temperature. Then the etched substrate and cover substrate were bonded together utilizing an UV-curable glue layer. An option shadow mask was used to avoid any chance of glue curing inside the channel. The sacrificial layer was melted and removed leaving enclosed microfluidie channels once the sealing step was complete. Results showed that the chips were successfully used for the separation of amino acids and metal electrodes can integrate into a microfluidic glass device.