纳米铜导电墨水的制备及研究

Preparation and Investigation on Copper Nanoparticles in Conductive Ink

以次磷酸钠为还原剂、硫酸铜为前驱体,并添加LomarD、PVP等表面活性剂及分散剂,在一缩二乙二醇(DEG)有机液相溶液中采用化学还原法成功地制备了在室温下能稳定60天的纳米铜导电墨水,通过电渗析除去墨水中的杂质离子,再采用减压蒸馏的方法可使纳米铜在墨水中的质量分数达到5%～30%,其中电渗析的除杂效率在99%以上。以XRD、TEM、EDX、ICP、HORIBALB550粒度分布仪对墨水进行表征,结果显示,墨水中纳米铜的粒径为15～40nm,分布较窄。设计正交试验分析了影响墨水中铜晶粒大小的一些因素发现,还原剂与前驱体的物质的量比、反应温度、pH值以及分散剂与表面活性剂的物质的量比等都对铜晶粒的生长有很大影响。

Using NaH2PO2·H2O as reductant, CuSO4·5H2O as precursor and adding surface-active agents and dispersing agents, such as Lomar D, PVP, nanoparticles copper conductive ink has been successfully prepared by chemical reduction and the ink in organisms（DEG） can be stable at ambient air for 60 days. And impurities in the plasma has been removed through electrodialysis and then using the method of the vacuum distillation nanocopper content （the ratio of quality） in conductive ink reaches 5%-30%, of which the electrodialysis impurity removal reaches more than 99% . After XRD, TEM, EDX, ICP and LB550 size distribution instrument are conducted to characterize the structure of the prepared nanoparticles copper conductive ink, the results show that the size of nanoparticles copper is distributed in the range of 15-40nm in diameter and the nanoparticles are spherical geometry. Orthogonal expreriment is done to analyse the factors that have an impact on the size of the copper grains in the ink and find that reducing agents and precursors of the molar ratio, temperature, pH value, decentralized agents and surfactants molar ratio of copper grains have great impact on growth.