化学镀非晶态镍磷和镍钨磷双层组合镀层工艺研究

RESEARCH ON THE TECHNIQUES OF ELECTROLYTIC PLATING Ni P AND Ni W P AMORPHOUS COMBINED FILMS

本文着重研究非晶态Ｎｉ－Ｐ和Ｎｉ－Ｗ－Ｐ双层组合镀层的化学镀工艺条件：如镀液组分及ｐＨ值等对镀层成分、镀层沉积速率的影响。实验结果表明：在苹果酸体系中化学镀镍磷镀层比较合适的艺条件为：硫酸镍０．１ｍｏｌ／ｌ，次磷酸钠０．２５ｍｏｌ／ｌ，苹果酸０．２０ｍｏｌ／ｌ，琥珀酸０．１５ｍｏｌ／ｌ，ｐＨ＝４．５～５．０，温度为９０℃。化学镀镍钨磷镀层比例适合的工艺条件为：硫酸镍０．１ｍｏｌ／ｌ，钨酸钠０．１５ｍｏｌ／ｌ，次磷酸钠０．１ｍｏｌ／ｌ，柠檬酸钠０．１５ｍｏｌ／ｌ，ｐＨ＝８～９，温度为９０℃。

The electrolytic plating techniques of the bottom film Ni P and the surface film Ni W P were studied respectively.The affects of the temperature,compositions,and pH value of the plating solution on the film composition and film deposition rate are involved.The results show that the suitable technique of electrolytic plating Ni P is:NiSO 4·6H 2O:0.1mol/l,NaH 2PO 2·H 2O:0.25mol/l,malic acid(C 4H 6O 5):0.20mol/l,amper acid(C 4H 6O 4):0.15mol/l,pH=4.5～5.0,T=90℃.The suitable technique of electrolytic plating Ni P W is :NiSO 4·6H 2O:0.1mol/l,Na 2WO 4:0.15mol/l,NaH 2PO 2·H 2O:0.1mol/l,Na 3C 6H 5O 7:0.15mol/l,pH=8～9,T=90℃.