期刊文献+

Improvements on high voltage performance of power static induction transistors

Improvements on high voltage performance of power static induction transistors
原文传递
导出
摘要 A novel structure for designing and fabricating a power static induction transistor(SIT)with excellent high breakdown voltage performance is presented.The active region of the device is designed to be surrounded by a deep trench to cut off the various probable parasitical effects that may degrade the device performance,and to avoid the parallel-current effect in particular.Three ring-shape junctions(RSJ)are arranged around the gate junction to reduce the electric field intensity.It is important to achieve maximum gate–source breakdown voltage BVGS, gate–drain breakdown voltage BVGD and blocking voltage for high power application.A number of technological methods to increase BVGD and BVGS are presented.The BVGS of the power SIT has been increased to 110 V from a previous value of 50–60 V,and the performance of the power SIT has been greatly improved.The optimal distance between two adjacent ring-shape junctions and the trench depth for the maximum BVGS of the structure are also presented. A novel structure for designing and fabricating a power static induction transistor(SIT)with excellent high breakdown voltage performance is presented.The active region of the device is designed to be surrounded by a deep trench to cut off the various probable parasitical effects that may degrade the device performance,and to avoid the parallel-current effect in particular.Three ring-shape junctions(RSJ)are arranged around the gate junction to reduce the electric field intensity.It is important to achieve maximum gate–source breakdown voltage BVGS, gate–drain breakdown voltage BVGD and blocking voltage for high power application.A number of technological methods to increase BVGD and BVGS are presented.The BVGS of the power SIT has been increased to 110 V from a previous value of 50–60 V,and the performance of the power SIT has been greatly improved.The optimal distance between two adjacent ring-shape junctions and the trench depth for the maximum BVGS of the structure are also presented.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第10期38-42,共5页 半导体学报(英文版)
基金 Supported by the Scientific and Technological Supporting Programme of Gansu Province(No.090GKCA052)
关键词 static induction transistor parasitic effect breakdown voltage deep trench static induction transistor parasitic effect breakdown voltage deep trench
  • 相关文献

参考文献10

  • 1Nishizawa J I, Motoyan K, Itioh A. The 2.45 GHz 36 W CW Si recessed gate type SIT with high gain and high voltage operation. IEEE Trans Electron Devices, 2000, 47(2): 482.
  • 2Sung Y M, Casady J B, Dufrene J B, et al. A review of SiC static induction transistor development for high-frequency power amplifiers. Solid-State Electron, 2002, 46:605.
  • 3Wang Yongshun, Li Hairong, Wu Rong, et al. Mechanism of reverse snapback on Ⅰ-Ⅴ characteristics of power SITHs with buried gate structure. Journal of Semiconductors, 2008, 29(3): 101.
  • 4Wang Yongshun, Wu Rong, Liu Chunjuan, et al. Improvement on high current performances of static induction transistor. Chinese Journal of Semiconductors, 2007, 28(8): 1192.
  • 5Bencuya I, Cogan A J, Butler S J, et al. Static induction transistors optimized for high-voltage operation and high microwave power output. IEEE Trans Electron Devices, 1985, 32(7): 1321.
  • 6Wang Yongshun, Wu Rong, Liu Chunjuan, et al. Researches on the injected charge potential barrier occurring in the static induction transistor in the high current region. Semicond Sci Technol, 2008, 23:152.
  • 7Wang Yongshun, Li Siyuan, Hu Dongqing. Dependence of Ⅰ-Ⅴ characteristics on structural parameters of static induction transistor. Solid-State Electron, 2004, 48:55.
  • 8Wang Yongshun, Li Siyuan, Yang Jianhong, et al. A novel buried-gate static induction transistor with diffused source region. Semicond Sci Technol, 2004, 19:152.
  • 9Wang Yongshun, Li Siyuan, Hu Dongqing. A microwave high power static induction transistor with dielectrics gate structure. Chinese Journal of Semiconductors, 2004, 25(1): 19.
  • 10Onose H, Yatsuo T, Watanabe A, et al. Design consideration for 2 kV SiC-SIT. Proceedings of 2001 International Symposium on power Semiconductor Devices & ICs, Osaka, 2001:179.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部