悬梁式陶瓷微热板的设计及热性能研究

The design and thermal property study of suspended hotplate based on ceramic substrate

结合传统陶瓷厚膜气体传感器和硅微加工气体传感器的特点,设计了基于陶瓷基底的悬梁式微热板结构,并提出一种无内引线的封装方式。对微热板的传热过程进行分析,并通过有限元工具对具有不同结构参数器件的热特性进行模拟,得到结构参数与器件热特性间的关系。通过控制工艺参数,在Al2O3陶瓷基底上制作出性能良好的Pt加热电阻及电极,并采用激光微加工技术实际制作了梁宽为0.2 mm和0.4 mm的两种结构器件。对器件的加热功率-温度关系进行测试,0.2 mm梁结构器件在400 mW加热功率下板上平均温度约为250℃,同模拟结果一致。

A novel ceramic-based suspended hotplate is designed, which combines the advantages of traditional ceramic gas sensors with micro machined silicon gas sensors. A new mounting style of bonding wire needless is proposed. The thermal conducting process is analyzed and FEM tool is used to simulate the thermal properties of different structures. The sputtered in alumina substrate by controlled lift-off Pt heater and electrodes with good performance are process. The devices with 0.2 mm and 0. 4 mm beam width are fabricated by using laser micromachining technique. The property of power consumption versus temperature is measured and it is found that the average temperature of hotplate is about 250℃ at lb 400mW power supply,which is agreement with the result of FEM simulation.