摘要
将Ag-Cu触点废料用酸溶解,再采用分步沉淀法去除Ag-Cu触点中的Ag^+、Sn^2+、Sn^4+,抽滤后得到含CuCl2的溶液,然后采用液相还原法制备微米级铜粉(质量分数≥99.9%)。利用X射线衍射和扫描电子显微镜测试颗粒的结构和形貌。结果表明:实验成功制备了形状均匀,粒径在0.3-0.6μm类球形的超细铜粉。
The waste Ag-Cu contacts were dissolved in acid,then Ag^+,Sn^2+ and Sn^4+in the solution were removed by fractional precipitation.After pumping filtration,the filtrate containing CuCl2 were obtained,then micron copper was produced by fluid phase reduction.The result showed that pure(Cu%≥99.9%) and the size about 0.3~0.6 μm Cu was produced.
出处
《环境工程》
CAS
CSCD
北大核心
2009年第5期110-113,共4页
Environmental Engineering
基金
国家科技支撑计划项目(2008BAC4B04)
江苏省高校自然科学重大基础研究项目(KYZ06032/06KJA61019)
关键词
Ag-Cu触点
分步沉淀
铜粉
copper and silver waste contact
fractional precipitation
copper powder