期刊文献+

工艺参数对T91/102TLP接头显微组织与性能的影响

Effect of process parameters on microstructure and properties of T91/102 TLP diffusion bonded joint
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摘要 在氩气保护下,用FeNiCrSiB非晶合金中间层对T91和102异种耐热钢管进行了瞬时液相扩散连接。通过接头力学性能、显微硬度、组织以及元素扩散的检测,分析了三种工艺参数对接头显微组织和力学性能的影响并得出了最佳工艺。结果表明,瞬时液相扩散连接可实现T91与102的成功连接,并且当连接温度在1230℃,等温凝固时间为4min,压力为4MPa时,接头两侧晶粒跨界面生长,组织均匀,焊缝变形小,强度高于母材。 T91/102 heat-resistant steel pipes were joined by transient liquid phase (TLP) diffusion bonding process with FeNiCrSiB amorphous alloy as filler in argon atmosphere.The effect of the bonding parameters on the microstructure and properties of bonded joint were analyzed by the test of mechanical properties,microhardness,microstrueture and elements diffusion,and the optimized process parameters were obtained.The tested results showed that the T91 and 102 can be jointed successfully by the TLP bonding and the both side of grains can grow cross the interface,the microstructures were homogeneous,the welding distortion is little and the strength of the joint was higher than that of the base metal when the parameters were bonding at 1 230 ℃ for 4 min under 4 MPa.
出处 《焊接》 北大核心 2009年第10期41-45,共5页 Welding & Joining
基金 西安市科技计划工业应用研发项目(YF07059)
关键词 T91/102 瞬时液相扩散连接 显微组织 性能 T91/102 TLP diffusion bonding microstructure properties
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