挠性PI基材上镂空板用开窗口工艺研究

Research on Process of Crosshatching for Hollowing Board on PI Flexible Substrate

介绍了一种在挠性聚酰亚胺基材上开窗口的新工艺。采用化学蚀刻法,蚀刻液由氢氧化钾、氢氧化钠和添加剂组成,于一定的工艺条件下在挠性印制电路板聚酰亚胺基材上开出所需大小、形状的窗口。结合镂空板工艺实例,详细介绍了工艺过程,并讨论了取得的效果与蚀刻机理。该方法克服了传统的开窗口工艺具有的先期投入和维护成本高、精度不够的缺点,可以完成高附加值的小型、高密度的挠性电路板的生产。

A new crosshatching technology on polyimide flexible substrate is described using chemical etching method. The etching solution is composed of Potassium hydroxide, Sodium hydroxide, and additives. The window of demanding is crosshatched in certain conditions on polyimide flexible substrate. The technology process and mechanism of etching are also discussed in detail with examples of hollowing board process. The demerits of the pre-investment and maintenance costs too high or precision too low to traditional crosshatching process are conquered. The new crosshatching technology on polyimide flexible substrate can be applied in the small and high-density FPCB products that have high added value.