摘要
本文采用金相切片、热分析技术等手段,通过对一个异常的PCBA爆板实例的分析,介绍了对PCB爆板失效的分析过程与分析方法,得出了失效机理及根本原因,同时给出了改进措施。。
The analysis process and methods of an abnormal delamination failure have been introduced by a failure analysis case for a PCBA sample with cross section analysis and thermal analysis. Then the failure theory and root causes of the failure are obtained, and some methods are given to prevent similar failures in the future.
出处
《电子产品可靠性与环境试验》
2009年第B10期94-98,共5页
Electronic Product Reliability and Environmental Testing
关键词
PCBA
爆板
金相切片
热分析
PCBA
delaimination
cross section analysis
thermal analysis
