摘要
通过对普通硫酸盐电镀铜,氨水电镀铜和焦磷酸盐电镀铜不同工艺所镀出铜层效果进行比较,探讨了无氰电镀铜的最佳工艺.
Craftworks of copper plating layer using electroplating copper of ordinary sulphate, ammonia and pyrophosphate were performed and compared. The results show that the craft of non-cyanide plating cpper is the best choece.
出处
《宜宾学院学报》
2009年第6期67-70,共4页
Journal of Yibin University
关键词
电镀
镀铜
无氰镀
electroplate
copper-plating
non-cyanogen copper-plating
