摘要
本文介绍了一种新的封装技术—微波多芯片组件（ＭＣＭ）技术。详细阐述了其设计环节并分析了设计要点，提出了通用的设计方法。
In this paper a novel packaging technology, Microwave MCM, was introduced. We discussed the step and key points of its design and also proposed the design method. Besides this, the manufacture sequence was also showed in this paper.
出处
《电讯技术》
北大核心
1998年第6期48-53,共6页
Telecommunication Engineering
