集成电路封装技术的发展与山东省的对策

Development of IC Package Technology andShandong Province's Countermeasure

本文介绍了当前集成电路封装技术的现状及今后的主要发展趋势，并就我省集成电路业的发展提出了建议。

The article introduces the current state of IC package technology and major developing trend in future, and puts forward suggests on development of Shandong Province's IC package technology.