碳纤维表面化学镀铜工艺研究

Technology for Electroless Copper Plating on the Surface of Carbon Fiber

传统的化学镀铜以甲醛作还原剂,污染环境。以环保型还原剂次亚磷酸钠代替甲醛,加入各种不同的稳定剂在碳纤维表面进行化学镀铜,获得了具有一定厚度、均匀、光亮的铜镀层。研究了镀液pH值、温度及还原剂、配位剂、稳定剂用量对化学镀铜溶液稳定性和碳纤维增重率的影响,确定了新的镀铜配方。用扫描电子显微镜(SEM)、X射线衍射仪(XRD)、能谱、冷热循环处理等手段,分析了化学镀铜层的微观形貌、结构及成分。结果表明,通过此新型的环保镀液配方和工艺条件,可获得光亮、致密、均匀及含铜量较高的镀层。

Uniform and bright copper coating with a certain thickness wasprepared on the surface of carbon fiber, using sodium hypophosphite as the alternate environmentally friendly reducing agent for formaldehyde and adding various stabilizing agents.The effects ofthe pH value and temperature of the plating bath, and the dose ofreducing agent, complexing agent, and stabilizing agents on thestability of the bath and plating rate of the Cu coating were investigated.And a novel bath formulation for electroless Cu platingwas determined.At the same time, the morphology, microstructure, and composition of the electroless Cu coating were analyzedusing a scanning electron microscope, an X-ray diffractometer,and an energy dispersive spectrometer.Results show that abright,uniform,and compact Cu coating with a higher content ofCu can be prepared on the surface of the carbon fiber by using theestablished plating bath formulation and plating parameters.