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基于MEMS开关的ET OFDM高效率PA设计

Study of MEMS ET OFDM PA of high efficiency
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摘要 本文研究了基于MEMS开关的ET结构OFDM功率放大器,采用预失真功率放大器的结构可提高功率放大器效率。分析OFDM的发射标准,利用低损耗,高隔离度的MEMS开关来实现ET结构电压选择。利用GaN HEMT(Heterostructure Field-Effect Transistors)RF382l晶体管建立了基于MEMS开关的ET结构的PA模型,进行了实际电路设计,并利用了ADS软件进行仿真分析,输入1W的OFDM信号时,漏极效率为52%,EVM约为2.94%,输出功率为50W,增益为13dB.该功率放大器完全可以应用于OFDM系统中。 This paper study the MEMS switch ET OFDM PA, and its efficiency is improved use the DPD structure. ET structure voltage is selected by MEMS switch due the MEMS switch have good insert loss and isolation. The OFDM transmitter specific is analyzed and PA model is built with ET structure, and then design the circuit. The circuit is simulated by ADS, and DE is 50% and EVM is 2.94% when input power is 1W. Output power about 50W and gain is 13dB. This PA is used in OFDM system.
出处 《激光杂志》 CAS CSCD 北大核心 2009年第5期30-31,共2页 Laser Journal
关键词 放大器 ET OFDM WIMAX PA ET OFDM WIMAX.
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参考文献8

  • 1Partl: WIMAX. Medium Access Control (MAC) and Physical Layer Specifications[ J]. IEEE Standard 802,16e/f/g 2005/2007.
  • 2Feipeng Wang, Annie Hueiching Yang. Design of Wide - Bandwidth Envelope- Tracking Power Amplifiers for OFDM Applications[J]. IEEE Transactions on microwave theory and techniques, April, 2005,53 (4) : 1244 - 1255.
  • 3郑惟彬,黄庆安,李拂晓.微波电路的MEMS开关进展[J].微波学报,2001,17(3):87-93. 被引量:12
  • 4孙建海,崔大付,苏波,王海宁.宽带RF-MEMS开关驱动电压的分析研究[J].微纳电子技术,2004,41(9):37-40. 被引量:7
  • 5P. Draxler, J. Deng, D. Kimball, I. Langmore, P.M. Asbeck. Memory Effect Evaluation and Predistortion of Power Amplifiers[J], 2005 IEEE MIT- sDig. ,TH2B,2005.
  • 6F. Wang, A. Ojo, D. Kimball, P. M. Asbeck, and L. E. Larson. Envelope tracking power amplifier with pre - distortion for WLAN 802. 11g[C].in IEEE MIT- S Int. Microwave Syrup.Dig. ,2004,1543- 1546.
  • 7Chen Yuquan. Microwave and RF, China Academic Journal publishing, Beijing, China,2007,46(11) : 15 - 18.
  • 8T. Marra, D. Kimball, J. Archambault, W. Haley, and J. Thoreback, Envelope. tracking efficiency enhancement for CDMA base station high power amplifer [ J]. IEEE Topical Workshop on Power Amplifiers for Wireless Communications, 2002,891 - 901.

二级参考文献15

  • 1[1]PETERSEN K E. Micromechanical membrane switch on silicon[J] . IBM J Res Develop, 1979, 23 (7): 376-385.
  • 2[2]LARSON L R E, HACKETT R H. Micromachined microwave actuator (MIMAC) technology-a new turning approach for microwave integrated circuits [A] . IEEE MMIC Symposium [C] .IEEE Xplore, 1991, 27-30.
  • 3[3]YAO J J, CHANG M F. A surface micromachined miniature switch for telecommunication application with signal frequencies from DC up to 4 GHz [A] . Transducers [C] . 1995. 384-387.
  • 4[4]GILDSM ITH C, ESHELMAN J R S. Characteristics of micromachined switch at microwave frequencies [A] . IEEE MTT-S Digest [C] . USA: San Diego, CA, 1998. 1141-1144.
  • 5[5]PACHECO S, NGUYEN C T, KATEHL L B. Micromechnical electrostatic K-band switches [A] . IEEE MTT-S International microwave symposium [C] . Baltimore Maryland, 1998, 569-1572.
  • 6[6]BARKER N S, REBEIZ G M. Distributed MEMS true-time delay phase shifter and wide-band switches [J] . IEEE Trans Mi-crowave Theory Tech, 1998, 46 (1): 1881-1885.
  • 7[7]MULDAVIN J B, REBEIZ G M. High Isolation CPW MEMS shunt switches part 1: Modeling [ J] . IEEE Trans MTT,1999, (11): 176-181.
  • 8[8]LIU Z W. Analytical model for high performance capacitive RF MEMS switch design [J] . International Journal of Nonlinear Sciences and Numerical Simulation, 2002, 3 (4): 365-368.
  • 9[10]CHANG H, QIAN J Y, XU Q,et al. RF MEMS capacitive switches fabricated with HDICP CVD SiNx [A] . IEEE MTT-S Dig [C] . USA: Seattle, WA, 2002. 231-234.
  • 10[11]BECHER D, CHAN R, HATTENDORF M, et al. Reliability study of low-voltage RF MEMS switches [A] . GaAs MANTECH Conference Digest of Papers [C] . USA: San Diego,CA, 2002. 256-260.

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