摘要
馆藏的早期黑白底片霉变严重,已对底片构成严重危害。为了有效治理霉变,通过对霉菌进行的分离、鉴定,分析了霉变产生的原因。并采用环境扫描电镜研究了霉菌对黑白底片影像的影响,通过模拟实验对其霉变前后的物理性能进行了测试,结果表明霉变后,底片的抗张强度、耐折度明显降低。在此基础上,探讨了防止霉菌发生的有效措施。
It is a serious phenomenon that the moldy of the early black-and-white films has affected the films harmfully. In order to prevent the moldy effectively, the paper isolated and identified the type of mold, and analysed the reasons of moldy. It was studied through SEM how the images of black-and-white film were influenced by mold. The physical performance was tested through its difference before and after moldy. The results showed that it is declined obviously by comparing the tensile strength and the folding resistance of the film. On this base, we offer a series of measures for avoiding the moldy.
出处
《影像技术》
CAS
2009年第5期26-30,共5页
Image Technology
关键词
黑白底片
霉变
物理性能
black-and-white film
moldy
physical property