热敏CTP技术初探

An Approach to Thermal CTP Technologies

本文系统介绍了各种主要的热敏CTP技术的成像原理和版材,包括:热烧蚀、热交联、热分解、热转移、热致相变化等技术的成像原理和相应版材的结构和性能特点。文中还阐述了热敏CTP技术的各种优势,如:高质量、高时效、低成本、高耐印力等,以及目前尚存在的不足之处,如:版材价格较高、曝光强度高、设备价格昂贵等。尽管如此,由于其综合的优势,目前世界上已安装的CTP系统中,热敏CTP约占一半。

This paper introduced systematically the imaging mechanism of main thermal CTP technologies including： thermal ablation, thermal cross-linking, thermal decomposition, thermal transfer and thermal phase transition etc,and the structure,working mechanism and characteristics of their relevant CTP plates.Their major superiorities are cited e.g.high quality,high timeliness,low production cost,high printing endurance etc,and also their shortcomings e.g. high price of thermal CTP plates and equipment,high exposure intensity etc. Nevertheless,thanks to their comprehensive advantages,the worldwide number of presently installed thermal CTP systems hit half of the total.