Mo-Cu合金制备及其致密化行为研究

PREPARATION AND DENSIFICATION OF Mo-Cu ALLOY

采用高能球磨的方法制备Mo-Cu复合粉末,系统研究了高能球磨对粉末形貌、烧结性能以及烧结坯显微组织的影响,并在此基础上对Mo-Cu致密化机理进行了初步探讨。研究结果表明:Mo-Cu液相烧结不同于传统的液相烧结,而与纯Mo的固相烧结致密化行为相似,Mo-Cu液相烧结致密化过程主要由固态骨架烧结所控制;球磨时间、烧结温度、烧结时间对于粉末烧结性能有很大影响。球磨时间24 h,在1050℃固相烧结60 min并于1300℃液相烧结90 min得到烧结坯致密度最高,相对密度为98.2%,烧结坯显微组织分布比较均匀,Cu相弥散分布于Mo骨架之间,无Cu富集现象,晶粒细小且尺寸相当。

Mo-Cu composites with Mo contents up to 85 wt pct were prepared by high energy ball milling and liquid-phase sintering. The effect of ball milling technology on Mo-Cu compound powder morphology,sintering behavior and microstructure of the material was studied and the densification mechanism of Mo-Cu was analyzed. The results indicate that the liquidphase sintering kate of Mo-Cu is much lower than that of traditional liquid-phase sintering and similar to that of solid-state densification rate of pure Mo. Milling time, sintering temper- ature and time could influence densification behavior during sintering greatly,and the highest densification,98.2% TD,was obtained milled for 24h,then sintered at 1300℃ for 90 min and held at 1050℃ for 60min. The microstructure was homogenous, and composed of relatively fine Mo grains and dispersed umiformly Cu particles.