脉冲电沉积时间对纳米晶镍镀层微观结构和性能的影响

Influences of pulse electrodeposition time on microstructure and performance of nanocrystalline nickel plating

采用脉冲电沉积法制备纳米晶镍镀层,利用扫描电镜、能谱仪、X射线衍射仪及显微硬度计对不同电沉积时间下制得的镍镀层的显微组织、微区成分、结构及力学性能进行表征分析。结果表明,不同电沉积时间下制得的镍镀层晶粒尺寸在21 nm小幅波动;随着电沉积时间的延长,纳米晶镍镀层的显微硬度存在先增大后缓慢降低的趋势,最大值为472 HV0.01,对应的电沉积时间为16 m in;纳米晶镍镀层的微观形貌为累积长大的胞状结构,电沉积时间为1-4 m in时,胞状结构表面密布着粒径为90 nm左右的二次纳米镍颗粒;本试验制得的纳米晶镍镀层失稳长大的起始温度为283.7℃,峰值温度为311.4℃。

Nanoerystaliine nickel plating was prepared by pulse electrodeposition method. The microstructure, microarea composition, structure and mechanical properties of nanocrystalline nickel platings under differernt electrodeposition time were characterized and analyzed with SEM, EDS, XRD and mierohardness tester. The results show that the grain sizes of nickel platings prepared under different eleetrodeposition time slightly fluctuate at 21 nm. The microhardness values of nickel platings first increase and then slowly decrease with the electrodeposition time prolonging, the maximum value is 472 HV0. 01 when the eleetrodeposition time is 16 min. The micro-morphology of nanocrystalline nickel is cumulative grew cellular structure, the surface of cellular structure is densely covered by second nanocrystalline nickel particles with size of about 90 nm when the electrodeposition time is 1-4 rain. The initial temperature is 283.7 ℃, and the peak temperature is 311.4 ℃, when the nickel plating unstablely grows up in this experiment.