三元共混改性酚醛树脂胶粘剂的研究

Study on Phenolic Adhesives Modified with Terpolymer Blends

本研究在以液体羧基丁腈橡胶改性酚醛树脂胶粘剂的基础上，为了进一步改进胶粘剂的室温、高温强度，又加入了环氧化酚醛（Ｆ－５１）进行了三元共混的研究．该研究中探讨了Ｆ－５１的用量对胶粘剂室温、高温剪切强度的影响．通过实验，发现随Ｆ－５１用量的增加，胶粘剂的室温剪切强度也相应增加，但２５０℃时的剪切强度，却在某一用量时出现峰值，确定了Ｆ－５１的最佳用量．通过测定热失重，计算出了耐热指数，分析了胶粘剂的耐热性．

Based on the prevous research of phenolic adhesives modified with liquid carboxyl NBR, a new type of heat resistant adhesive was developed by adding another componentepoxied phenolic resin (F-51). With the varied amount of epoxied phenolic resin, the shear strength of adhesives was measured at room temperature and high temperature (250℃).With increase of the amount of epocied phenolic (F-51),the shear strength of adhesives was increased at room temperature,and had a maximum valve in a position of 8 parts at high temperature(250℃). By measuring of adhesives' weight loss at high temperature, it was formed its heat resistant Index. It is possible to use the type of phenolic adhesives of terpolymer blends for the bonding situation of heat resistance.