摘要
采用热刺激电流(TSC)对自制的4种不同纳米Al2O3含量的聚酰亚胺(PI)薄膜进行测试,发现复合材料的热刺激电流峰值随着纳米Al2O3填充量的增加而降低,当纳米Al2O3的填充量大于10%后,热刺激电流峰的峰值随着温度升高持续一段时间后才出现下降趋势。对4种薄膜的TSC高温峰分别进行计算,得出薄膜中陷阱电荷的数量。并结合纳米复合材料的多核模型和陷阱理论,得出该现象的出现是由于PI/Al2O3纳米复合薄膜中界面结构影响了载流子输运过程造成的。
Four kinds of self-made polyimide （PI） film with different nano-Al2O3 loading were tested using TSC technology. The results show that the peak values of the TSC decrease with the increase in nano-Al2O3 loading under the same conditions. When nano-Al2O3 loading is more than 10wt%, the TSC peak values of TSC keep a period of time and then decrease. According to the multi-core model of the nano-composites and the trap theory, the phenomenon results from the effect of interface between polyimide and nano-Al2O3 on the transport process of the carriers.
出处
《绝缘材料》
CAS
北大核心
2009年第5期38-40,44,共4页
Insulating Materials
基金
国家863项目(2006AA11A178)
关键词
纳米复合材料
热刺激电流
界面结构
陷阱
nano-composites
thermally stimulated current（TSC）
interfacial structure
trap
