光谱成像仪CCD组件的热分析及验证

Thermal design and proof tests of CCD components in spectral imagers

光谱成像仪是集多光学通道和多探测器于一身的复杂的空间光学遥感器,其成像器件CCD热设计的好坏直接关系成像的质量。本文根据CCD组件具有体积小、发热量高、升温速度快等特点,提出了CCD组件的热设计原则,解决了热设计中的关键问题,给出了相应的热设计方案。按照CCD器件的导热路径,通过简化的热阻分析模型,计算得出了CCD器件的沿程总热阻为1.291℃/W。应用IDEAS-TMG对此组件进行了仿真分析,分析显示其达到了热控设计的指标要求。最后对热设计方案进行了试验验证,结果表明,热设计中采用的热控方法有效控制了CCD组件工作过程中的温度过高及温升速率过快的缺点,其升温速率为0.6℃/min,两次试验中最高温度分别为33.6℃和26.2℃。

The spectral imager is a complex space optical remote sensor with multiple optical channels and detectors,in which CCD components play a decisive role for imaging quality of the system. In this paper, the conspicuous characteristics of CCD components, such as small volume, high heat productivi- ty and fast temperature rise speed, are discussed and analyzed. The keys in the thermal design are solved,then a corresponding thermal design schemes of CCD components is introduced. Moreover, the total thermal resistance of CCD components along a heat transfer path is calculated through a simpli- fied thermal resistance analytic model, which shows the total thermal resistance along the heat transfer path is 1. 291 ℃/W. The CCD components are also simulated by the software IDEAS-TMG and the guide line of thermal control is achieved. Finally, the thermal design scheme is verified by proof heat tests. The test results indicate the temperature rise speed is 0.6 ℃/min when CCD components are working,and the maximum temperature in two tests are 33.6 ℃ and 26.2 ℃, respectively. These re- sults conclude that proposed thermal design scheme can control high heat productivty and fast temperature rise for CCD components effectively.