摘要
连接温度是完成瞬时液相扩散连接、保证焊接接头性能的关键参数,采用不同连接温度1 210℃、1 230℃和1 250℃对T91/12Cr2MoWVTiB进行瞬时液相扩散连接,连接压力为2 MPa,保温时间为4 min,结果表明,在1 210～1 250℃范围内,随着温度的增加,焊接接头的成分越来越均匀,连接区域的显微硬度分布逐渐趋于平缓,接头的力学性能也随之提高。
The bonding temperature is the key parameters for transient liquid phase diffusion welding and welded joint properties. In this paper, transient liquid phase diffusion welding experiments for T91/12Cr2MoWVTiB are carried out at different temperature： 1 210 ℃ ,1 230 ℃ and 1 250 ℃ with the holding time of 4 min and the pressure of 2 MPa. The resuits show that, the chemical compositions of the joints become more and more homogenized, the microhardness becomes gently and the mechanical properties also become better and better with the increasing of the bonding temperature from 1 210to 1 250℃.
出处
《新技术新工艺》
2009年第10期98-100,共3页
New Technology & New Process
基金
河南理工大学教学改革专项基金资助项目(0645031)
关键词
连接温度
瞬时液相扩散
成分
显微硬度
力学性能
Bonding temperature, Transient liquid phase diffusion, Chemical compositions, Microhardness, Mechanical properties
