摘要
环保和微电子器件高度集成化的发展驱动了高性能无铅焊料的研究和开发,Sn-Ag-Cu系无铅焊料由于具有良好的焊接性能和使用性能,已逐渐成为一种通用电子无铅焊料。文章通过实验的方法,研究了8种不同配比的Sn-Ag-Cu焊料中银、铜含量对合金性能(包括熔点、润湿性和剪切强度)的影响,并对焊料的显微组织进行对比与分析,得出低银焊料的可靠性比高银焊料好,同时Sn-2.9Ag-1.2Cu的合金具有较低的熔点且铺展性好,为确定综合性能最佳的该系焊料合金提供了依据。
The R＆D of the lead-flee solder of high performance has been pushed forward by the highly developed environment conservation and integrated microelectronic devices. The electronics industry begins to focus upon the Sn-Ag-Cu system alloys as they have the advantages of good reliability and good solderability. This text studies the influence of the content of Ag and Cu to function of the Sn-Ag-Cu Solder and analysis the microstructure of the solder by experiment. It shows no advantages in terms of processing, reliability,or availability for the high-silver alloys as compared to the low-silver alloys.And the Sn-2.9Ag-1.2Cu solder has the lower melting point and the better spreadahility. It provides the basis for the best performance of the Sn-Ag-Cu Lead-free Solder.
出处
《电子与封装》
2009年第10期10-13,共4页
Electronics & Packaging
