摘要
由于电子芯片技术的高速发展,集成度不断提高,芯片功耗大和散热困难的问题也凸现出来,传统的散热方法在一些超高热流密度场合已经不能有效为芯片提供冷却。蒸气压缩制冷可望成为现代高热流电子器件及系统冷却的重要技术,国外主要电子系统公司均已采用蒸气压缩制冷来实现电子系统冷却。要使蒸气压缩制冷在电子系统中得到广泛应用,必须进一步研发高效紧凑的微型制冷压缩机、研制能与电子芯片紧密结合的微型蒸发器以及高效的冷凝器。
As the fast development of electronic technology and the integration level of chips, it appears that the chips＇ power is increasing greatly and hard to cool them by traditional chip cooling methods. Especially when faced super high heat flux density,mainly current cooling technology may have inadequate capacity to handle the problems. Vapor compression refrigeration （VCR） technology may be a promising key technology for high power microelectronic cooling. VCR technology has been used by many famous electronic equipments manufacturer. Miniature refrigeration compressor, miniature evaporator and miniature condenser must be further researched so as to promote the wide application of VCR to electronic cooling.
出处
《制冷与空调》
2009年第5期5-9,52,共6页
Refrigeration and Air-Conditioning
关键词
芯片冷却
蒸气压缩式制冷
强化换热
压缩机
高热流密度
冷凝器
蒸发器
chip-cooling
vapor compression refrigeration
enhanced heat transfer
compressor
high heat flux density
condenser
evaporator
