摘要
采用磁控溅射法在CAT.No.7101玻璃基底上沉积了W/Al双层金属膜,并对其进行纳米压痕实验。利用非线性有限元法对压痕过程进行仿真,分析了膜基体系的应力分布。结果表明:磁控溅射法制备的薄膜组织均匀、力学性能好。W/Al双层金属膜系中的W薄膜的弹性模量与硬度平均值分别为75.4335GPa、6.206GPa,其值与块状W材料的相应参数差别较大。仿真曲线与实验结果基本相符,能够反映出膜基体系的力学状态以及应力分布规律。
W/Al bilayer-metal films were deposited on CAT.NO.7101 glass substrates using the magnetron sputtering method. Nano-indentation test was performed on the observed film samples. The loading and unloading processes of nano-indentation tests were simulated via the non-linear finite element method, and the stress distribution in the film-substrate system was analyzed. The results show that W/Al films fabricated by the magnetron sputtering method exhibit uniform strticture and good mechanical properties. The elastic modulus and the mean value of hardness of W film in the W/Al bilayer-metal films are 75.433 5 GPa and 6.206 GPa respectively, which are quite different from the corresponding parameters of bulk W. The simulation curves well agree with the experimental results and clearly reflect the mechanical states as well as stress distribution of the film-substrate system.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第11期60-63,共4页
Electronic Components And Materials
基金
江苏省自然科学基金资助项目(No.BK2008227)
广西自然科学基金资助项目(No.0339037)
关键词
磁控溅射
纳米压痕
力学性能
有限元仿真
应力分布
magnetron sputtering
nano-indentation
mechanical properties
finite element simulation
stress distribution
