红外光学成像技术在电路板上的应用

Infrared optical imaging technology in circuit board applications

红外热成像技术是现代影像学中的一门新兴技术.它与x射线、B超、CT、核磁共振等显像技术的成像原理不同,它不主动发射任何射线,只是被动接受热源所发射出的红外线,经过处理,从而绘制出热源的影像.它的最大特点就是不用接触待检测物体.本文利用红外光学成像技术,来检测电路板的工作状态.该技术可以将出现故障的大规模集成电路板中数以万计的微小元器件的影像传输到计算机中,经过计算机的分析,就可以很容易的分析出具体故障所在.

The technology of IR and thermal image is an emerging technology in modem imaging technology. The principle of the technology of IR and thermal image is not the same as x-ray, B-chao, CT, magnetic resonance imaging technology. It does not take the initiative to launch any ray, only a passive acceptance of heat emitted by the infra - red, processed in order to draw heat out of the image. The most major characteristic is not contact to treat the examination object. This article is use of infrared optical imaging technology to detect the working condition of circuit wafer. The technology may appear the breakdown in the large scale integrated circuit board the thousands small primary device phantom to transmit in the computer. After the computer analysis, may the very easy analysis concrete breakdown in.