摘要
采用DSC热分析对S酚醛树脂的固化过程进行了动力学研究,得出了该树脂的固化工艺温度及固化动力学参数,其凝胶化温度、固化温度和后处理温度分别为360.7K、421.6K和463.4K;反应级数n=0.912、表观活化能E=76.14kJ.mol-1,反应频率因子A=4.704×108min-1。采用红外光谱分析初步探讨了该树脂的固化机理,结果表明其固化反应主要是苄羟基与苯环邻位上活泼氢产生交联缩合反应,少量为苄羟基之间的缩合反应。
The cure reaction processing of the ablative resistant phenolic resin was studied by differential scanning calorimetry （DSC）. The reference curing processing temperature and the curing kinetic parameters of the resin were obtained. Its gelling temperature, curing temperature, and post-treating temperature was 360.7K, 421.6K and 463.4K respectively, and the average curing apparent activation energy E, the frequency factor A and the reaction order n was 76.14kJ·mol^-1, 4.704×10^8min^-1 and 0.912 respectively. The curing mechanism of the resin was that the hydroxymethyl groups mainly reacted with the hydrogens at the ortho position of the benzene rings.
出处
《广州化工》
CAS
2009年第7期76-78,共3页
GuangZhou Chemical Industry
基金
山东省博士后创新基金项目资助(200703022)
