Cu-Ag-Si-Ga系低蒸气压钎料合金研究

Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure

研究了Cu—Ag—Si—Ga系钎料合金的熔化特性、加工性能和在Cu、Ni和不锈钢母材上的铺展性、钎焊接头强度以及Ga对钎料合金微观组织的影响。推荐一种典型的钎料，其成分为40Ag-2Si-2Ga-余量Cu（质量分数％），熔化温度为786．1～823．0℃，在500℃的条件下的蒸气压低于5．51×10^-8Pa，该钎料适合用于850～870℃电真空器件分级钎焊。

This article studied the melting characteristic, working property of Cu - Ag - Si - Ga series brazing filler alloys and spreading characteristic of them on Cu, Ni and stainless steel plates as well as the brazing strength and effect of Ga on microstructure of experimental alloys. A typical brazing filler alloy is recommended, the chemical composition of it is 40% Ag - 2% Si - 2% Ga - remnant Cu, melting temper- ature is 786.1 -823.0℃, vapor pressure is lower 5.51× 10^-8 Pa. This brazing filler alloy is suitable for grade brazing of electro - vacuum devices at 850 - 870℃.