摘要
高性能计算机和通信系统的互连传输速率超过10Gbps,信号频谱高端已达数10GHz(MGH)以上。本文分析了MGH背板的互连方式,讨论了高性能PCB板材和连接器的性能和应用能力。针对MGH背板高速率串行传输的信号完整性设计要求,提出采用小角度布线、反钻和双直径过孔的设计技术,并在工程设计中得到了成功应用。
The transmit rates of SERDES have approached 10 Gbps in high performance computer and telecom system, the high-end of frequency spectra in the serial links even reached over Multi-GigaHertz. This article has discussed the link method on NIGH backplane. The key parameters and the application of high-performance printed circuit board （PCB） materials and backplane connectors have been presented. For achieving reliable transmission and signal integrity in the design of MGH backplane, this article proposes the angled （or zigzag） routing method, as well as the technoques of backdrilling via and dual diameter via, and these techniques have been successful applied in practical project.
出处
《计算机工程与科学》
CSCD
北大核心
2009年第A01期5-7,13,共4页
Computer Engineering & Science
基金
国家自然科学基金资助项目(60873212)
