摘要
高密度基板上的微孔质量对封装微电子器件十分重要,由于孔密度大,孔径又小,目前普遍采用激光打孔。针对基板的组成材料以及激光加工中主要参数对微孔加工的影响进行分析研究。通过不同材料粘结力和改变激光的功率、脉宽等措施,改善基板电子元器件封装的质量。
The quality of micro via on HDsubstrate is important for packaged microelectronics compo- nent. Laser drill was generally used for small diameter and high density of the micro via. The influence of substrate material and the main parameters of laser processing on laser drill was analyzed and studied. The packaging quality of microelectronics components on substrate was improved through changing of adhesive power of different material, and tuning the power and pulse width of laser.
出处
《包装工程》
CAS
CSCD
北大核心
2009年第11期38-39,52,共3页
Packaging Engineering
关键词
基板微细孔
激光加工
封装质量
micro via of substrate
laser processing
packaging quality
