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纳米银导电墨水及其成膜性能研究

Preparation of Conductive Ag Nano-ink and Study of Its Filming Performance
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摘要 用化学还原法制备了纳米Ag粉,并通过X射线衍射(XRD)、激光粒度分析仪(LPSA)、透射电子显微镜(TEM)、扫描电子显微镜(SEM)等测试手段对样品进行性能表征。在所选择的实验条件下制备了类球形分布、分散性好的Ag纳米颗粒,其粒径主要分布在5~50nm范围,平均粒径为16nm,晶体结构为fcc结构。经涂布检测,Ag纳米墨水制备的墨膜均匀致密,150℃回火后,银粒子烧结明显,有微孔均匀分布。 Silver nano-particles were prepared by chemical reduction method. The product was charac- terized by x ray diffraction (XRD), laser particle size analyzer(LPSA), transmission electron microscopy (TEM), and scanning electron microscopy(SEM). The experimental results showed that the Ag nano-- particles are in high dispersion state with mostly quasi-spherical shapes, the average particle size is about 16nm with a size range between 5nm to 50nm. It was also found that the crystal structure of theAg nano powders is namely fcc structure. Spin coating and sintering revealed that as prepared nano-Ag ink can form uniform dense film; when tempered at 150℃ for lh, the powder obviously agglomerates, and with homo- geneous micro hole in it.
出处 《包装工程》 CAS CSCD 北大核心 2009年第11期79-80,106,共3页 Packaging Engineering
基金 中山市科技计划项目(20083A256) 人才引进项目(2009Y10)资助
关键词 导电墨水 纳米银 烧结 conductive ink nano sliver sintering
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参考文献8

  • 1FAN L,SU B,QU J,et al. Effects of Nano sized Particles on Electrical and Thermal Conductivities of Polymer Corn posites [C]//Proceedings of 9th International Symposium on Advanced Packaging Materials. Atlanta : IEEE, 2004 :193 - 199.
  • 2YE L,LAI Z,LIU J,et al. Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesive[J]. IEEE Trans Electron Pack Manuf,1999,22(4):299-302.
  • 3SHI F G, MIKRAJUDDIN A,CHUNGPAIBOONPATANA S, et al. Electrical Conduction of Anisotropic Conductive Adhesives: Effect of Size Distribution of Conducting Filler Particles[J].Mater Sci Semicond Process, 1999,2 (3) : 263- 269.
  • 4HOFF S B. Screen Printing: A Contemporary Approach[M]. Minneapolis : Delmar Publishers, 1997.
  • 5MICHEAL B, BERNARD A, BITESH A, et al. Printing Meets Litho: Soft Approaches to High Resolution Patterning[J]. Journal of Research & Development,2001,45(8):112- 117.
  • 6NIKITIN P V,LAM S,RAO K V S. Low Cost Silver Ink RFID Tag Antennas[J]. Proceedings of IEEE Antennas and Propagation Society International Symposium, 2005,2B : 353- 356.
  • 7MOLESA S E. Ultra-low-cost Printed Electronics[M]. Calif:Tech Rep UCB/EECS- 2006 - 55, University of California, Berkeley, 2006.
  • 8吴海平,吴希俊,葛明园,刘化章,张国庆.填料粒径对各向同性导电胶渗滤阈值的影响[J].中国科学(E辑),2008,38(3):448-454. 被引量:4

二级参考文献14

  • 1Shi F G, Mikrajuddin A, Chungpaiboonpatana S, et al. Electrical conduction of anisotropic conductive adhesives: Effect of size distribution of conducting filler particles. Mater Sci Semicond Process, 1999, 2(3): 263-269
  • 2Sun M. Conductivity of conductive polymer for flip chip bonding and BGA socket. Microelectron J, 2001, 32(3): 197-203
  • 3Wong C P, Lu D. Development of solder replacement isotropic conductive adhesives. In: Proceedings of 3rd Electronics Packaging Technology Conference. Singapore: EPTC, 2000. 214-221
  • 4Sung K K, Rajinder S R, Sampath P. Development of high conductivity lead (Pb)-free conducting adhesives. IEEE Trans Compon Pack Tech, 1998, 21(1): 18-22
  • 5Lu D, Wong C P. Isotropic conductive adhesives filled with low-melting-point alloy fillers. IEEE Trans Electron Pack Manuf, 2000, 23(3): 185-190
  • 6Stefan K, Bernd H G, Ralf H, et al. Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles. IEEE Trans Compon Pack Tech, 1997, 20(1): 15-20
  • 7Ye L, Lai Z, Liu J, et al. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives. IEEE Trans Electron Pack Manuf, 1999, 22(4): 299-302
  • 8Fan L, Su B, Qu J, et al. Effects of nano-sized particles on electrical and thermal conductivities of polymer composites. In: Proceedings of 9th International Symposium on Advanced Packaging Materials. Atlanta: IEEE, 2004. 193-199
  • 9Li L, Morris J E. Electrical conduction models for isotropically conductive adhesive joints. IEEE Trans Compon Pack Tech, 1997, 20(1): 3-8
  • 10Arriagada F J, Osseo-Asare K. Synthesis of nanosize silica in a nonionic water-in-oil microemulsion: Effects of the water/surfactant molar ratio and ammonia concentration. J Colloid Interf Sci, 1999, 211 (2): 210-220

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