期刊文献+

CO_2激光直写PMMA微流道实验研究 被引量:1

Experimental Research on CO_2 Laser Direct-writing Machining PMMA Microchannel
下载PDF
导出
摘要 激光直写法制造聚合物微流控芯片是一种新型微细加工技术,为了研究激光加工工艺参数与微流道深度的关系,利用实验室研制的精密实验台进行了CO2激光直写PMMA微流道实验研究。得到了激光功率、扫描速度、激光加工次数与微流道深度的关系,并对流道长度、流道深度和流道宽度的相互关系也进行了研究。实验结果表明,当激光功率在15 W~35 W,扫描速度在0.2 m/s~0.45 m/s范围内,理论模型与实验结果偏差最小,不超过6μm,该范围为最佳激光工艺参数范围。 Laser direct-writing manufacturing polymer microfluidic chip is a new micromachining technology. In order to study the relationship between laser processing parameters and microehannel depth, experimental research on CO2 laser micromaehining PMMA microchannel was carried out through a precision experimental table. The relationship among laser power, scanning velocity and machining passes and microchannel depth was obtained, and the interrelationship among microehannel length, microehannel depth and mieroehannel width was also studied. The experimental results indicates that the difference between the theoretical data and the experimental data is only about 6μm when the laser power is 15 W-35 W and the scanning velocity is 0.2 m/s-0.45 m/s.
出处 《机械科学与技术》 CSCD 北大核心 2009年第11期1447-1450,共4页 Mechanical Science and Technology for Aerospace Engineering
关键词 CO2激光 直写 微细加工 微流控芯片 微流道 CO2 laser direct-writing micromachining microfluidic chip microchannel
  • 相关文献

参考文献10

  • 1殷学锋,方群,凌云扬.微流控分析芯片的加工技术[J].现代科学仪器,2001,18(4):10-14. 被引量:27
  • 2徐兵,魏国军,陈林森.激光直写技术的研究现状及其进展[J].光电子技术与信息,2004,17(6):1-5. 被引量:10
  • 3Klank H, Kutter J P, Geschke O. CO2-laser micromachining and back-end processing for rapid production of PMMA-based microfluidic systems[J]. Lab on a Chip, 2002, (2) :242 -246.
  • 4Jensen M F, Noerholm M, et al. Mierostructure fabrication with a CO2 laser system: characterization and fabrication of cavities produced by raster scanning of the laser beam [ J ]. Lab on a Chip, 2003, (3) :302 - 307.
  • 5Chung C K, Lin Y C, Huang G R. Bulge formation and improvement of the polymer in CO2 laser mieromachining[ J]. Journal of Micromechanics Microengineering, 2005,55 : 1878 - 1884.
  • 6相恒富,傅建中,陈子辰.激光加工聚合物微流控芯片暂态烧蚀模型研究[J].浙江大学学报(工学版),2005,39(12):1920-1924. 被引量:3
  • 7魏仁选,姜德生,周租德.准分子激光脉冲直写刻蚀速率与能量密度的关系[J].光学精密工程,2004,12(2):231-234. 被引量:6
  • 8Waddell E A, Locascio L E, Kramer G W. UV laser micromachining of polymers for microfluidic applications [ J ]. Journal of the Association for Laboratory Automation, 2002,7 ( 1 ) : 78 -82.
  • 9Chryssolouris G. Laser Machining: Theory and Practice[ M]. New York, Springer, 1991.
  • 10Fogarty B A, Heppert K E, Theodore J, et al. Rapid fabrication of poly (dimethylsiloxane) -based mieroehip capillary electrophoresis devices using CO2 laser ablation[J]. The Analyst, 2005, 130(6) :923, -930.

二级参考文献35

  • 1颜树华,戴一帆,吕海宝,李圣怡.二元光学器件激光直写技术的研究进展[J].半导体光电,2002,23(3):159-162. 被引量:7
  • 2侯德胜,杜春雷,邱传凯,白临波.ISI-2802激光直写系统及其应用[J].光电工程,1997,24(S1):27-31. 被引量:6
  • 3周继烈,程耀东.结构陶瓷激光加工的热应力分析[J].浙江大学学报(工学版),2004,38(9):1204-1207. 被引量:5
  • 4伊福廷,吴坚武,冼鼎昌.微细加工新技术—LIGA技术[J].微细加工技术,1993(4):1-7. 被引量:13
  • 5SMUK A Y, LAWANDY N M. Selective etching in laser written semiconductor-doped glasses [J]. Optics Communications , 1998,156: 297-299.
  • 6IHLEMANN J, RRBAHN K. Excimer laser micro machining: fabrication and applications of dielectric masks[J].Applied Surface Science, 2000,587-592.
  • 7BRAUN A, ZIMMER K, HOSSELBARTH B. Excimer laser micromachining and replication of 3D optical surfaces[J]. Applied Surface Science, 1998,911-914.
  • 8OHJI H, FRENCH P J, TSUTSUMI K. Fabrication of mechanical structures in p-type silicon using electrochemical etching[J]. Sensors and Actuators, 2000,82: 254-258.
  • 9MODEST. Three-dimensional transient model for laser machining of ablating/decomposing materials [J]. Journal of Heat Mass Transfer, 1996,39(2) :221 -234.
  • 10DIETER B. Laser processing and chemistry [M]. Berlin:Springer, 1996.

共引文献41

同被引文献15

引证文献1

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部