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室温红外探测用非晶Ti薄膜的制备及表征

Preparation and Characterization of Amorphous Ti Films for Uncooled Infrared Detectors
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摘要 采用快速蒸发并冷却衬底的方法,在不同衬底结构上制备出了电阻温度系数(TCR)优于0.25%的红外探测用非晶Ti薄膜。通过表征分析了氧对薄膜电阻影响,以及组分对其性能的影响。研究表明,Ti薄膜有较强吸附氧能力,低价态的Ti利于红外探测。提出采用保护层和非氧硅化物牺牲层以提高薄膜探测能力。 Amorphous Ti films for uncooled infrared detectors with the TCR overmatch of 0.25% were successfully prepared on different structural substrates by the method of quickly evaporating and cooling the substrates. The effects of oxygen on the resistance of films and that of components on performance are characterized. The experimental results show that Ti with lower valence is better for uncooled infrared detectors. It is proposed that the protecting layer and the sacrificial layer with non-oxidative silicide can be applied to improve the detectivity.
出处 《半导体光电》 CAS CSCD 北大核心 2009年第5期708-710,730,共4页 Semiconductor Optoelectronics
基金 电子科技大学青年基金资助课题
关键词 室温红外探测 红外探测材料 微测辐射热计 Ti薄膜 非晶薄膜 uncooled infrared detection infrared detection material microbolometer thermal conductance Ti films amorphous films
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参考文献10

  • 1李华高,杨子文,刘爽.非制冷红外探测器用VO_x薄膜的制备[J].半导体光电,2001,22(1):38-40. 被引量:10
  • 2Schlag H J,Scherber W. New sputter process for VO2 thin films and examination with MIS-elements and CV-measurements[J]. Thin Solid Films, 2000,366:28.
  • 3陈长虹,易新建,张静,熊笔峰.基于VO_2薄膜非致冷红外探测器性能研究[J].红外与毫米波学报,2001,20(2):136-138. 被引量:15
  • 4Jain V K. Uncooled IR-sensor array based on MEMS technology[J]. Proc. SPIE, 1999,3903:206-215.
  • 5Ramakrishna M V S. Performance of titanium and amorphous germanium microbolometer infrared detectors[J]. Proc. SPIE, 1999,3666:415-420.
  • 6Lee H Y, Yoon J B, Yoon E. A high fill-factor IR bolometer using multi-level electrothermal structures [J]. IEEE IEDA,1998:463-466.
  • 7Lee H Y,Yoon J B, Yoon E, et al. A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures [ J ]. IEEE, Trans. on Electron. Devices, 1999, 46(7) :1489-1491.
  • 8Tanaka A,Matsumoto S, Teranishi N, et al. Infrared focal plane array incorporating silicon IC process compatible bolometer[J]. IEEE Trans. on Electron. Devices, 1996, 43(11) :1844-1850.
  • 9唐明奇,祝庆,李福山.Ti基大块非晶的耐磨性研究[J].铸造技术,2005,26(10):941-943. 被引量:6
  • 10赵凯生,刘爽,龙再川,杜昊,冯林.室温红外探测薄膜电阻温度系数测试技术[J].半导体光电,2006,27(1):49-51. 被引量:2

二级参考文献23

  • 1王永寿.非冷却型红外探测器[J].飞航导弹,1998,12:44-49.
  • 2刘春林.用退火工艺获得晶态薄膜[J].量子电子学报,1998,15(5):521-525.
  • 3[1]Jahanzeb A, Travers C M, Celik-Butler Z.A semiconductor YBaCuO microbolometer for room temperature IR imaging.IEEE Trans. Electron Devices, 1997,44: 1795—1801
  • 4[2]Herring R J, Howard P E. Design and performance of the ultra 320×240 uncooled focal plane array and sensor.SPIE,1996,2746: 2—12
  • 5[3]Jerominek H,Picard F,Swart N R,et al. Micromachined uncooled VO2-based IR bolometer arrays.SPIE,1996,2746: 60—71
  • 6[4]Liddiard K C. Thin-film resistance bolometer IR detectors.Infrared Phys.,1984,24: 57—64
  • 7[5]Sedky S,Fiorini P,Baert K,et al. Characterization and optimization of infrared poly SiGe bolometers.IEEE Trans. Electron Devices,1999,46: 675—681
  • 8王永寿,飞航导弹,1998年,12卷,44页
  • 9刘春林,量子电子学报,1998年,15卷,5期,521页
  • 10曲喜新,薄膜物理,1994年

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