摘要
The current-voltage (I-V) curves, such as linear sweep voltammetry (LSV) and cyclic voltammetry (CV), were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I-V curve, the electrochemical states of active, passive, transient and trans-passive region could be characterized. And then, the mechanism of the process of voltage-induced material removal in electrochemical mechanical polishing (ECMP) of copper was investigated. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) analyses were used to observe the surface profile. Finally, the oxidation and reduction processes of the Cu surface were monitored by the repetition of anodic and cathodic potential from cyclic voltammetry (CV) method in acid-and alkali-based electrolyte.
The current--voltage （I-V） curves, such as linear sweep voltammetry （LSV） and cyclic voltammetry （CV）, were employed to evaluate the effect of electrolyte concentration on the electrochemical reaction trend. From the I-V curve, the electrochemical states of active, passive, transient and trans-passive region could be characterized. And then, the mechanism of the process of voltage-induced material removal in electrochemical mechanical polishing （ECMP） of copper was investigated. Scanning electron microscopy （SEM） and energy dispersive spectroscopy （EDS） analyses were used to observe the surface profile. Finally, the oxidation and reduction processes of the Cu surface were monitored by the repetition of anodic and cathodic potential from cyclic voltammetry （CV） method in acid- and alkali-based electrolyte.
出处
《中国有色金属学会会刊：英文版》
CSCD
2009年第B09期262-265,共4页
Transactions of Nonferrous Metals Society of China
基金
supported by grant No.R01-2006-000-11275-0 (2008) from the Basic Research Program of the Korea Science & Engineering Foundation
