摘要
介绍湿法刻蚀技术在硅片加工中的应用,重点讨论了湿法刻蚀设备中供应化学液的化学管路系统的设计,管路上主要安装的部件及其功能,以及各部件的布置方式。通过对湿法刻蚀技术中主要工艺参数的影响程度来分析和调整管路上主要部件的使用和布置位置。
The application of Wet Chemical Etching in wafer fabrication is reviewed in this paper, and with focus on the designing of chemical cycle system, include the main components and their functions and placements. According as the effect to the main wet etching process parameters, adjust the usages and placements of the components.
出处
《电子工业专用设备》
2009年第10期30-33,共4页
Equipment for Electronic Products Manufacturing
关键词
硅片加工
湿法刻蚀
化学管路系统
Wafer fabrication
Wet etching
Chemical Cycle System
