预热温度对BGA钎焊球质量影响

The influence of preheating temperature on the quality of BGA solder ball

钎焊球是BGA及BGA等高密封装技术中凸点制作关键材料。预热温度是影响钎焊球质量关键因素。本文采用切丝重熔法制作钎焊球,研究了预热温度对63Sn37Pb钎焊球真球度和外观质量的影响。结果表明:在实验条件下,随着预热温度升高,钎焊球真球度逐渐升高,表观质量逐渐变好。当预热温度500℃～600℃时,钎焊球真球度和外观质量变化不明显。从使用角度出发,预热温度稍大于500℃为宜。

A solder ball is the key material of the bump fabrication in the BGA and BGA high integrated package. The preheating temperature is the main factors to affect the quality of the solder ball. In the paper the solder ball is fabricated by the fine wire cutting remelting method. The influence of preheating temperature on the real sphericity and the surface appearance of the solder ball are investigated. Results show that the real sphericity and surface appearance of the solder ball became better and better with the increasing of preheating temperature within the range of preheating temperature. When the preheating temperature is in between 500℃--600℃, the effect of the preheating temperature on the real sphericity and the surface appearancel is not distinct. So the optimal preheating temperature is about 500℃ in practice.