摘要
芯片尺寸封装(CSP)技术是一项新兴的芯片封装技术,目前正在成为一项主流技术,本文主要介绍了它在发达国家的发展动态和一些技术内容。
CSP is a brand new chip package technology, and is now becoming the mainstream. This article mainly introduces its technical contents and its development trend in some developed countries.
