多层芯片堆叠封装方案的优化方法

Optimized Method of Multi-Layer Stacked Chip Package Scheme

芯片堆叠封装是提高存储卡类产品存储容量的主流技术之一,采用不同的芯片堆叠方案,可能会产生不同的堆叠效果。针对三种芯片堆叠的初始设计方案进行了分析,指出了堆叠方案失败的原因和不足。结合两种典型芯片堆叠封装结构(金字塔型和悬梁式)的特点,提出了一种采用转接芯片完成焊盘转移的优化方法,并举例进行了芯片堆叠封装方案的说明。最后,对转接芯片的制作及尺寸设计原则进行了研究。

3D stacked chip package is one of the mainstream technologies in improving the storage capacity of memory card products. Different stacked chip schemes will also possibly produce different stacked package effects. Three initial design schemes of stacked chip package were analyzed, and the reasons for the failure of the schemes were pointed out. One optimized method to transfer the die pad by the adapter chip was presented, which was combined by the two typical stacked chip packages （pyramid and cantilever）. Furthermore, an example in stacked chip package with adapter chip was proposed. Finally, the produced method and the size design of the adapter chip were studied.