摘要
Au-Sn(质量分数为20%)共晶焊料有着优良的导热和导电特性,已被广泛应用在光电子和微电子的器件封装工业中。对微氰和无氰电镀Au-Sn合金的两种电镀方法进行了研究,概述了镀液组分和电镀工艺条件,用扫描电镜的方法测试不同电流密度下Au-Sn合金组分,用测厚仪测试镀层厚度,计算出镀速,最终确定电镀Au-Sn(质量分数为20%)合金的电镀条件,并对微氰和无氰电镀液优缺点进行了对比分析。
Au-Sn （20%） eutectic solder has superior mechanical strength and thermal performance, so it is widely used in optoelectronics/electronics industry. Mcro-cyanide and non-cyanide eleetroplating solutions for Au-Sn alloy were developed, and the bath composition and plating conditions were overiviewed. The Sn content was tested in different current density by SEM （scanning electron microscope）. Plating velocity was calculated by thickness of coating and time. The plating conditions of Au-Sn （20%） were determined. And the comparative analysis of advantages and disadvantages was made for micro-cyanide and non-cyanide electroplating solution
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第11期1066-1069,共4页
Semiconductor Technology
基金
国家自然科学基金(60676035)
河北省自然科学基金(F2005000084)
关键词
金锡合金
微氰
无氰
电镀
电流密度
扫描电镜
Au-Sn alloy
micro-cyanide
non-cyanide
electroplating
current density
SEM
