摘要
以电器开关盒上盖为实例,应用MPI软件对其注塑过程中的填充、冷却、翘曲进行模拟。分析了填充时间、熔接痕等情况,得到合理的浇口位置;通过研究翘曲的影响因素,提出了改进翘曲的方案,最终减小了翘曲变形。
Taking the injection molding of electrical switch box cover as an example, the processes of the filling, cooling and warpage of the plastics parts in the injection molding were simulated by means of MPI software. The gating location was obtained by analyzing the filling time and weld mark; and the improvement plan of the warp was made by studying the effecting factors of warp, and ultimately the warpage was reduced.
出处
《塑料科技》
CAS
北大核心
2009年第11期69-71,共3页
Plastics Science and Technology
